project-embeddedSystemDesign2.pro

update=wo 20 mrt 2019 20:17:52 CET
version=1
last_client=kicad
[general]
version=1
RootSch=
BoardNm=
[cvpcb]
version=1
NetIExt=net
[eeschema]
version=1
LibDir=
[eeschema/libraries]
[schematic_editor]
version=1
PageLayoutDescrFile=
PlotDirectoryName=
SubpartIdSeparator=0
SubpartFirstId=65
NetFmtName=
SpiceAjustPassiveValues=0
LabSize=50
ERC_TestSimilarLabels=1
[pcbnew]
version=1
PageLayoutDescrFile=
LastNetListRead=project-embeddedSystemDesign2.net
CopperLayerCount=2
BoardThickness=1.6
AllowMicroVias=0
AllowBlindVias=0
RequireCourtyardDefinitions=0
ProhibitOverlappingCourtyards=1
MinTrackWidth=0.08889999999999999
MinViaDiameter=0.45
MinViaDrill=0.2
MinMicroViaDiameter=0.2
MinMicroViaDrill=0.09999999999999999
MinHoleToHole=0.25
TrackWidth1=0.25
TrackWidth2=0.254
TrackWidth3=0.3048
TrackWidth4=0.381
TrackWidth5=0.508
TrackWidth6=0.762
TrackWidth7=1.016
ViaDiameter1=0.8
ViaDrill1=0.4
ViaDiameter2=1.7272
ViaDrill2=1.016
dPairWidth1=0.2
dPairGap1=0.25
dPairViaGap1=0.25
SilkLineWidth=0.12
SilkTextSizeV=1
SilkTextSizeH=1
SilkTextSizeThickness=0.15
SilkTextItalic=0
SilkTextUpright=1
CopperLineWidth=0.2
CopperTextSizeV=1.5
CopperTextSizeH=1.5
CopperTextThickness=0.3
CopperTextItalic=0
CopperTextUpright=1
EdgeCutLineWidth=0.05
CourtyardLineWidth=0.05
OthersLineWidth=0.15
OthersTextSizeV=1
OthersTextSizeH=1
OthersTextSizeThickness=0.15
OthersTextItalic=0
OthersTextUpright=1
SolderMaskClearance=0.051
SolderMaskMinWidth=0.25
SolderPasteClearance=0
SolderPasteRatio=-0