mspm0: generate features per chip + package #4194
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This pull request along with some work on the mspm0-metapac side now allows the
Peripheralstype to only pins that are available for a chip + package combo. This is to match the behavior in embassy-stm32.All the examples and tests build and run as intended.
get_chip_cfgsis a little cursed but that is temporary since I plan to deal with interrupt groups after this.Regarding feature names, I have chosen to exclude temperature rating so the same feature is used before a standard (
S) and Q100 qualfied (Q1) part. Embassy doesn't care whether your parts on tape & reel or tray, so distribution method is excluded.For reference:
Fun fact, there are 128 part numbers for MSPM0 parts. Only 25x less than the STM32. Unfortunately more parts are coming so hopefully TI doesn't catch up soon.